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> 기술정보 > 연구개발
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| ITEM |
2002 |
2003 |
2004 |
2005 |
| R&D
ITEM |
Target item |
H/P Key-PAD |
Note PC, Combo |
Small PDA |
Small Flip Chip |
| Car ECU, PDP |
IMT-2000 |
Light weight
Note PC |
High resolution IMT-2000
|
| DSC & C/R Module |
333㎒ DDR SD RAM |
Com- munication |
Slim type DVD-RAM |
| LCD Driver |
PDA + Mobile |
HDTV |
3D HDTV |
| PCB
Spec |
PatternL/S |
75/75㎛ |
50/50㎛ |
35/35㎛ |
30/30㎛ |
| TH
Pitch |
0.7㎜ |
0.6㎜ |
0.6㎜ |
0.45㎜ |
| Hole
Size |
Φ250um |
Φ200um |
Φ75∼100um |
Φ50∼70um |
| Impedance |
60Ω±10% |
40Ω±7% |
28Ω±7% |
20Ω±5% |
| Target PCB |
Flex PCB forCOB |
Rigid-Flex
(MLB4+D/S) |
Build up Flex(1+6+1) Embedded Flex |
PI Flip Chip
|
| C/R ModuleMLB4-8 |
PM-B/U MLB
(CB-102) |
(Build in component) |
Optical Fiber PCB |
| HP MLB6 (IVH) |
B²IT B/U MLB8-10
Rigid Flex Process |
Ink-Jet type PCB(S/M, M/K) |
| Major
Tech. Item |
FPC
process / Lay up |
Plating
Distribution |
Fine
Imaging tech |
Ultra
thin PCB |
| CBN
res. / Impedence |
Paste
Bump Printing |
Build
up / Hot press |
High
resolution formation |
| IVH
& Hole Plugging |
DFR
type Build UP |
Additive
process |
Built
in passive/ active device |
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