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> Technology Info > R&D
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| ITEM |
2002 |
2003 |
2004 |
2005 |
| R&D
ITEM |
Target item |
H/P Key-PAD |
Note PC, Combo |
Small PDA |
Small Flip Chip |
| Car ECU, PDP |
IMT-2000 |
Light weight
Note PC |
High resolution IMT-2000
|
| DSC & C/R Module |
333快 DDR SD RAM |
Com- munication |
Slim type DVD-RAM |
| LCD Driver |
PDA + Mobile |
HDTV |
3D HDTV |
| PCB
Spec |
PatternL/S |
75/75妣 |
50/50妣 |
35/35妣 |
30/30妣 |
| TH
Pitch |
0.7妙 |
0.6妙 |
0.6妙 |
0.45妙 |
| Hole
Size |
白250um |
白200um |
白75＃100um |
白50＃70um |
| Impedance |
60戒▽10% |
40戒▽7% |
28戒▽7% |
20戒▽5% |
| Target PCB |
Flex PCB forCOB |
Rigid-Flex
(MLB4+D/S) |
Build up Flex(1+6+1) Embedded Flex |
PI Flip Chip
|
| C/R ModuleMLB4-8 |
PM-B/U MLB
(CB-102) |
(Build in component) |
Optical Fiber PCB |
| HP MLB6 (IVH) |
B昌IT B/U MLB8-10
Rigid Flex Process |
Ink-Jet type PCB(S/M, M/K) |
| Major
Tech. Item |
FPC
process / Lay up |
Plating
Distribution |
Fine
Imaging tech |
Ultra
thin PCB |
| CBN
res. / Impedence |
Paste
Bump Printing |
Build
up / Hot press |
High
resolution formation |
| IVH
& Hole Plugging |
DFR
type Build UP |
Additive
process |
Built
in passive/ active device |
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